发明名称 ELECTRONIC COMPONENT SUPPLYING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To reduce suction failure of electronic components in an electronic component mounting system. SOLUTION: A holding head rotates around a rotating axis line and spots at a plurality of stop positions to receive electronic components and mount the components to a printed circuit board, while a component supplying table moves in the X axis direction to supply electronic components 38 from a feeder. An imaging apparatus located at the component holding attitude detecting position picks up images of suction nozzle at the rotating position to receive components and the rotating position isolated by 180 degrees from such position in order to detect position error ΔXA of the nozzle rotating axis line and bending ΔXN of suction pipe, correct the moving data of component supply table which is set based on the intrinsic suction position of electronic components 38 and to ensure stable suction of electronic components 38 with the suction surface 201 at the intrinsic suction position by correcting the moving position of feeder 36. After the start of mounting process, positional error in the X axis direction of feeder 36 is detected based on detection of the holding position error of electronic component 38 with the suction nozzle.
申请公布号 JP2002368489(A) 申请公布日期 2002.12.20
申请号 JP20010168155 申请日期 2001.06.04
申请人 FUJI MACH MFG CO LTD 发明人 KOIKE HIROKAZU;ITO TOSHIYA;SUHARA SHINSUKE
分类号 H05K13/04 主分类号 H05K13/04
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