| 发明名称 |
METHOD FOR ASSEMBLING ELECTRONIC COMPONENT WITH SOLDER BALL AND ELECTRONIC COMPONENT |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To form solder balls of uniform height in a ball forming process without increasing steps. SOLUTION: Height of solder balls is made uniform by mounting solder balls 1 on the electrodes (2a, 2b) of an electronic component and reducing or eliminating oxidation of solder balls at the time of thermally fusing the solder balls for bonding.</p> |
| 申请公布号 |
JP2002368044(A) |
申请公布日期 |
2002.12.20 |
| 申请号 |
JP20010178071 |
申请日期 |
2001.06.13 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAKURAI DAISUKE;AZUMA KAZUJI;OTANI HIROYUKI |
| 分类号 |
B23K1/00;B23K3/06;B23K31/02;B23K101/42;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
B23K1/00 |
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