发明名称 METHOD FOR PREVENTING WARPAGE OF CIRCUIT BOARD, METHOD FOR CORRECTING WARPAGE, AND JIG USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a method for preventing warpage of a circuit board, a method for correcting the warpage of a circuit board containing it and a jig used therefor by which a circuit board can be heat-treated at low cost and warpage can be prevented from occurring on a circuit board. SOLUTION: A warpage preventing jig 10 is formed by embedding a plurality of magnets 14 into a flat plate 12. A circuit board 16 is overlapped onto the jig 10, and magnets 18 are placed on the board 16. The board 16 is fixed on the jig 10 by attraction between the magnets 14 embedded in the jig 10 and the magnets 18 on the board 16. In this state, the board 16 is heat-treated.
申请公布号 JP2002368388(A) 申请公布日期 2002.12.20
申请号 JP20010175318 申请日期 2001.06.11
申请人 MURATA MFG CO LTD 发明人 MORI HIROAKI;OTA YOSHITERU
分类号 H05K3/34;H05K3/22;(IPC1-7):H05K3/22 主分类号 H05K3/34
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