发明名称 Electronic module assembly technique uses spring clip in to secure components to circuit board, in addition to soldered joints
摘要 The method for assembly of an electronic module (1), uses a printed circuit (12) and a further component (11) connected by solder joints. The module also includes a set of extension elements (16) for mounting the module on the circuit board. A spring fixing clip is used to ensure mechanical of the components after soldering The method provides assembly for an electronic module (1), comprising at least two components, on an application card (2). The components include a printed circuit (12) and a further component (11) connected by solder joints. The module also includes a set of extension elements (16) for mounting the module on the circuit board. A spring effect is achieved using a special fixing clip in creating the mechanical connection, such as to guarantee the mechanical connection of the components after soldering. The components mounted on the printed circuit board include a RF processing circuit, a digital processing circuit and an analogue processing circuit.
申请公布号 FR2826231(A1) 申请公布日期 2002.12.20
申请号 FR20010008064 申请日期 2001.06.19
申请人 WAVECOM SA 发明人 BIBIKOFF DE ALEXIS
分类号 H05K1/00;H05K1/14;H05K3/30;H05K3/34;H05K13/04 主分类号 H05K1/00
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