发明名称 METHOD OF MANUFACTURING LIGHT-EMITTING DIODE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting diode which eliminates defects due to conventional method where a molded reflection frame is used, and can improve the quality and reliability of a light-emitting diode product, and enables reduction in size and cost. SOLUTION: The method of manufacturing the light-emitting diode comprises a first process of coating many LED elements formed on a substrate with a translucent resin, a second process of hardening the translucent resin and then removing a part of it in between each LED element, a third process of filling recessed parts formed by the second process with a light-reflecting resin, and a fourth process of hardening the light-reflecting resin and then cutting the substrate, so as to leave the light-reflecting resin around each LED element and separate the substrate into individual light-emitting diodes. The first and the second process can be replaced with the formation of an insular translucent resin using a metal die or the like.
申请公布号 JP2002368281(A) 申请公布日期 2002.12.20
申请号 JP20010177821 申请日期 2001.06.12
申请人 CITIZEN ELECTRONICS CO LTD 发明人 FUKAZAWA KOICHI;ISHII HIROHIKO;WATANABE MASAHIDE
分类号 H01L25/075;H01L33/54;H01L33/56;H01L33/60 主分类号 H01L25/075
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