| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip semiconductor light-emitting device, which is capable of efficiently dissipating heat released from a semiconductor light-emitting element, without deteriorating its reflection efficiency and restrained from causing a short circuit between terminal electrodes, when a circuit board is subjected to soldering. SOLUTION: One end of a semiconductor light-emitting element 13 is electrically fixed to an electrode 12a, the other end of the element 13 is connected to an electrode 12b with a gold wire 14, and the semiconductor light-emitting element 13 is sealed with transparent resin 15 for the formation of a chip semiconductor light-emitting device 10. A ceramic core 16 is provided to a part of the chip board 11, located directly under the semiconductor light-emitting element 13, penetrating through the board 11 from above. |
