发明名称 COMPONENT HEIGHT MEASURING METHOD AND APPARATUS IN COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain component height measuring method and apparatus in light weight and low price component mounting apparatus which uses a component suction nozzle for actually sucking components to measure height of components with higher accuracy including fluctuation of the component suction nozzle itself. SOLUTION: The component height measuring apparatus 1 in the component mounting apparatus comprise a vacuum/positive pressure supply source which also operates as a component suction nozzle 2, a vacuum/positive pressure switching electromagnetic valve provided between the vacuum/positive pressure supply source and component suction nozzle, an air-pressure or air-flow detecting means provided between the vacuum/positive pressure switching electromagnetic valve and component suction nozzle and a calculating means for calculating height of component based on the result of detection by the air-pressure or air-flow detecting means.
申请公布号 JP2002368491(A) 申请公布日期 2002.12.20
申请号 JP20010178048 申请日期 2001.06.13
申请人 SONY CORP 发明人 KAKINUMA BUICHI
分类号 B25J15/06;H05K13/04;H05K13/08 主分类号 B25J15/06
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