| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board material which is capable of easily manufacturing a circuit pattern of a wiring pitch 100μm or below through a sputtering method and also manufacturing a printed wiring board with high productivity. SOLUTION: A first metal layer of non-ferromagnetic heat-resistant alloy composed of ferromagnetic metal and non-ferromagnetic metal is formed on the surface of a polymer base material, and furthermore a second metal layer is formed on the surface of the first metal layer.
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