BUMP FORMATION METHOD AND BUMP FORMING APPARATUS TO SEMICONDUCTOR WAFER

摘要

A bump formation method and a bump forming apparatus to a semiconductor wafer are provided in which a productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head (190), a recognition device (150), and a control device (180). ICs formed on the semiconductor wafer are divided to basic blocks (230). Bump formation is carried out continuously to the ICs included in one basic block. Position recognition to the other basic block is carried out only when the bump formation operation is shifted from one basic block to the other basic block. Thus, in comparison with the conventional art whereby the position recognition operation is carried out every time bumps are formed to each IC, the number of times of the recognition is greatly reduced, so that the productivity can be improved.