| 摘要 |
A highly thermally conductive composite material is characterized in that it contains 20-75 Vol % of SiC, with the balance being Cu, and further contains a reaction preventive layer interposed on the interface between SiC and Cu for preventing a reaction between the two substances. Specifically, the reaction preventive layer is a thin film having a thickness of 0.01-10 microns, consisting of carbon or a carbide of at least one element selected from the group consisting of Cr, Nb, Ta and W. In particular, the composite material has a thermal expansion coefficient of 4.5-10x10-6/K and a thermal conductivity of 200 W/mK or higher.
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