发明名称 |
Semiconductor package and fabrication method of the same |
摘要 |
Disclosed is a semiconductor package capable of realizing a small and compact size and improving the reliability and the fabrication method of the same. The disclosed comprises: a main semiconductor chip having a plurality of main chip pads and operating as a lead frame or a substrate; a plurality of metal patterns electrically connected to each corresponding main chip pad and having electrodes formed on both ends; one or more sub semiconductor chip adhered to the main semiconductor chip by adhering bumps formed on a plurality of sub chip pads to each corresponding electrode; a dam formed on the main semiconductor chip in a shape surrounding the inner electrodes except for the outer electrodes on the outmost region of the main semiconductor chip; filling materials filled up in the dam; and a plurality of solder balls adhered on the outmost electrodes. |
申请公布号 |
US2002190354(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020167702 |
申请日期 |
2002.06.12 |
申请人 |
PARK KYE CHAN |
发明人 |
PARK KYE CHAN |
分类号 |
H01L25/18;H01L23/48;H01L23/485;H01L25/065;H01L25/07;(IPC1-7):H01L23/495 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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