ELECTRONIC PART COMPRESSION−BONDING APPARATUS AND METHOD

摘要

Connection failure of an electronic part to be mounted on a board by thermocompression bonding is prevented by accurately controlling the expansion of the electronic part. An electronic part compression−bonding apparatus comprises a compression−bonding unit (41) for thermocompression−bonding an electronic part on a board, a pressure supply unit (48), a pressure control unit (83) for controlling the pressure, a heating unit (43) for heating the compression−bonding unit (41), a temperature control unit (85), and a thermocompression−bonding control unit (80) for controlling the pressure control unit (83) and the heating unit (43) according to thermocompression−bonding condition data including the pressure and heating temperature at least one of which is variably set during the step from the start to end of the thermocompression−bonding of the electronic part. The thermocompression−bonding condition data is set to a first pressure at a first substep of the thermocompression−bonding step and to a second pressure lower than the first pressure at a second substep subsequent to the first step.