| 摘要 |
<p>One kind or at least two kinds of functional water such as ozone dissolving water, alkali ion dissolving water and acid ion dissolving water is supplied onto a semiconductor wafer (102) held on a spinning mechanism (104) according to the object of cleaning of a semiconductor wafer, then the semiconductor wafer (102) is irradiated thereonto with an exicimer lamp (101) for a specified time as a secondary energy to facilitate the cleaning reaction of functional water, and the semiconductor wafer (102) is cleaned by being spun via a spinning mechanism (104) during an appropriate process. A cleaning/processing method comprises the steps of supplying DHF (dilute hydrofluoric acid) onto a semiconductor wager (102) held on a spinning mechanism (104), and cleaning the semiconductor wafer (102) while being spun via the spinning mechanism (104).</p> |
