发明名称 |
CLEANING/PROCESSING DEVICE FOR UNPROCESSED ELEMENT AND CLEANING/PROCESSING METHOD |
摘要 |
One kind or at least two kinds of functional water such as ozone dissolving water, alkali ion dissolving water and acid ion dissolving water is supplied onto a semiconductor wafer (102) held on a spinning mechanism (104) according to the object of cleaning of a semiconductor wafer, then the semiconductor wafer (102) is irradiated thereonto with an exicimer lamp (101) for a specified time as a secondary energy to facilitate the cleaning reaction of functional water, and the semiconductor wafer (102) is cleaned by being spun via a spinning mechanism (104) during an appropriate process. A cleaning/processing method comprises the steps of supplying DHF (dilute hydrofluoric acid) onto a semiconductor wager (102) held on a spinning mechanism (104), and cleaning the semiconductor wafer (102) while being spun via the spinning mechanism (104).
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申请公布号 |
WO02101808(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
WO2002JP04798 |
申请日期 |
2002.05.17 |
申请人 |
KABUSHIKIKAISHA TSUKUBA SEMI TECHNOLOGY;OHTAKE, KIYOSHI |
发明人 |
OHTAKE, KIYOSHI |
分类号 |
H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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