Control signal transmitting method with package power pin and related integrated circuit package structure

摘要

A method and a device are disclosed for transmitting a control signal to an option pad of an integrated circuit chip at its package level. The method includes the steps of: electrically isolating one of a plurality of commonly connected power transmitting pins of the integrated circuit package; connecting the electrically isolated power transmitting pin to the option pad to thereby transmit a control signal from outside through the electrically isolated power transmitting pin to the option pad.