发明名称 |
Method and apparatus for filling a gap between spaced layers of a semiconductor |
摘要 |
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.
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申请公布号 |
US2002192320(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020212893 |
申请日期 |
2002.08.05 |
申请人 |
BRAND J. MICHAEL |
发明人 |
BRAND J. MICHAEL |
分类号 |
B29C70/72;F28F7/00;H01L21/20;H01L21/44;H01L21/4763;H01L21/48;H01L21/50;H01L21/56;H01L23/44;H01L23/48;H01L29/40;(IPC1-7):B29C70/72 |
主分类号 |
B29C70/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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