Electronic element with a shielding

摘要

Element comprising a carrier (1) having at least an electrically conductive mass plane (2); a flipped chip die (5) mounted on said carrier (1), the flipped chip die having a backside (5A) opposite to a front side (5B) directed towards the carrier (1); and an electromagnetic interference shield which comprises an electrically conductive means (8) electrically connecting an electrically conductive layer (7) of the backside (5A) of the flipped chip die (5) to the mass plane (2) of the carrier (1).