| 摘要 |
A process for manufacturing a semiconductor circuit device includes the steps of forming a plurality of semiconductor chips (2) across dicing lines (3) on a wafer (1), dividing each chip from the wafer, die-bonding the chip onto a die-pad (11) of the lead-frame, connecting a pad electrode (12) of the chip and a terminal (14) of the lead-frame with a wire (15), and forming a resin seal (16) covering the connection between the pad electrode and the terminal. Then, the dicing line has a predetermined width for dividing each chip, and the dicing line includes a test element group (4) and an adjusting mark (5). Accordingly, in the step of forming the plurality of chips, a cross line (6) having no test element group and no adjusting mark is provided on the dicing line for connecting between the pad electrode and the terminal with the wire.
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