发明名称 Semiconductor decive fabricating equipment using radio frequency energy
摘要 A semiconductor device fabricating equipment using radio frequency energy is capable of preventing a wafer from being polluted by various kinds of polymers deposited indiscriminately on the respective portions within a chamber, having a housing which divides and forms the inside such that an upper electrode part applying the radio frequency energy is in an upper side thereof, a chuck assembly which applies the radio frequency energy, fixes a provided wafer, and is installed so as to ascend and descend, opposite to the upper electrode part inside the housing, and a baffle plate which is fixingly-installed onto an inner wall of the housing so that an inner side edge portion is positioned adjacent to a side wall of the chuck assembly with a given space therebetween. The baffle plate is fixed and installed onto the inner wall of the housing, and an outer side shape of the ascending/descending-driven chuck assembly is formed simply. Accordingly, the effect of an eddy flow phenomenon caused by the ascending/descending-driving of the chuck assembly is reduced, and a wafer is prevented from being polluted and damaged by controlling a flow of polymer which reacts as a particle on the wafer.
申请公布号 US2002189762(A1) 申请公布日期 2002.12.19
申请号 US20020036455 申请日期 2002.01.07
申请人 KIM JONG HEE 发明人 KIM JONG HEE
分类号 H01L21/02;C23C16/44;H01J37/32;(IPC1-7):C23F1/00;C23C16/00 主分类号 H01L21/02
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