发明名称 |
Semiconductor module having multiple semiconductor chips |
摘要 |
A multiple semiconductor chip (multi-chip) module includes at least an output semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The output semiconductor chip may have a bulk substrate configuration and the control semiconductor chip may have a Silicon-On-Insulator (SOI) configuration. The output semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics such as enhanced heat sink efficiency and reduced EMI.
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申请公布号 |
US2002190317(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20010884223 |
申请日期 |
2001.06.19 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
MUKHERJEE SATYEN;MOBERS TON |
分类号 |
H01L25/07;H01L25/16;H01L25/18;(IPC1-7):H01L27/01;H01L29/74 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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