发明名称 |
Fabrication of high temperature low hysterisis shape memory alloy thin film |
摘要 |
A nickel titanium hafnium copper thin film shape memory alloy having a composition (TiHf)5-55(NiCu)45-50 comprising about 2 atomic percent to about 10 atomic percent copper and the fabrication method of said shape memory thin film by magnstron sputtering using Kr as working gas and conducting the deposition at elevated substrate temperature.
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申请公布号 |
US2002189719(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20010835510 |
申请日期 |
2001.04.16 |
申请人 |
RASMUSSEN GREGORY K.;ZHANG JINPING;CHANG FENGLIAN;GOLD TERRY J. |
发明人 |
RASMUSSEN GREGORY K.;ZHANG JINPING;CHANG FENGLIAN;GOLD TERRY J. |
分类号 |
C22C30/00;C22F1/00;C23C14/14;C23C14/34;(IPC1-7):C22C30/00 |
主分类号 |
C22C30/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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