| 摘要 |
A fabricating method of semiconductor devices in which pads of a semiconductor chip of center-pad structure and bonding pads of a printed wired board are connected electrically. In an area of the printed wired board corresponding to the pads of the chip an extracting line for plating is formed, and circuit pattern electrically connecting the extracting line, terminal portions for external input/output and bonding pads is formed. The steps of electroplating the terminal portions and the bonding pads while supplying electricity from the extracting line, and removing the area of the printed wired board corresponding to the pads of the chip together with the extracting line to form a window portion are further comprised. A fabricating method of semiconductor devices in which to pads of a semiconductor chip of center-pad structure leads extending from circuit pattern of a printed wired board is connected. In an area of the printed wired board corresponding to the pads of the chip a plurality of leads are formed, conductive connection pieces for plating connecting end side of the respective leads is formed along a boundary line of the area, and circuit pattern electrically connecting terminal portions for external input/output and the conductive connection pieces is formed, respectively. The steps of, while supplying electricity to the terminal portions and leads through the conductive connection pieces, electroplating these, and removing insulating film only of an area corresponding to the pads of the chip to form a window together with leads are further comprised.
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