| 摘要 |
<p>An exposure device (10), comprising temperature stabilization flow passage devices (100A, 100B) forming a part of the flow passages for the gas supplied by a feeder (52, 56, 58, 62, 64) and, after suppressing a variation in temperature of the gas flowing thereinto, allowing the gas to flow out into a space inside an exposure chamber (16), for example, into a moving space of a wafer stage (WST) inside a main column (34) through jetting units (102A, 102B), whereby the gas with suppressed temperature variation can be supplied into the exposure chamber and, accordingly, the controllability of temperature in the exposure chamber can be increased by suppressing a variation in temperature of the gas in at least a part of the inside of the exposure chamber.</p> |
