发明名称 |
Method for manufacturing electric circuit on substrate, involves applying and structuring laminated layer on first layer, before applying second layer |
摘要 |
A method for manufacturing an electric circuit on a substrate (1), in which a first layer (2) is applied to the substrate by thermal spraying. Before applying a second layer (4) on the first layer, a laminated layer (3) is applied and structured so that by applying the second layer only the sections of the first layer not covered by the laminated layer are coated with the second layer.
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申请公布号 |
DE10130257(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
DE20011030257 |
申请日期 |
2001.06.22 |
申请人 |
HELLA KG HUECK & CO.;ZAVT ZENTRUM FUER AUFBAU- UND VERBINDUNGS-TECHNIK GMBH |
发明人 |
KERSTEN, PETER;KUNZE, JUERGEN;SELLENT, MANFRED;POHLMANN, WOLFGANG;BOLZENIUS, RAINER |
分类号 |
H05K1/05;H05K3/04;H05K3/14;(IPC1-7):H05K3/02;H05K1/00 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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