发明名称 SEMICONDUCTOR STRUCTURE WITH RESISTIVE PATH
摘要 High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. The compliant substrate includes an accommodating buffer layer (304, 404) that comprises a layer of monocrystalline oxide spaced apart from at least a portion of a silicon wafer (302, 402) by an amorphous interface layer (306, 406) of silicon oxide. A resistive path (310, 422) for a circuit component on a monocrystalline compound semiconductor layer (308, 408) overlying the layer of monocrystalline oxide (304, 404) includes portions of the monocrystalline substrate (302). A portion of a waveguide (410) may be coupled to the resistive path (422).
申请公布号 WO02101826(A1) 申请公布日期 2002.12.19
申请号 WO2001US50692 申请日期 2001.12.27
申请人 MOTOROLA, INC. 发明人 FRANSON, STEVEN JAMES,
分类号 H01L21/20;H01L21/8258;H01L27/06;H01L27/08;(IPC1-7):H01L21/825 主分类号 H01L21/20
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