发明名称 |
Semiconductor chip, chip-on-chip structure device, and assembling method thereof |
摘要 |
A semiconductor chip (3) to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks (35) provided on a back face (34) thereof. The electrode marks (35) are respectively provided in association with a plurality of electrodes (33) provided on the front face (31) of the semiconductor chip in the same arrangement as the arrangement of the electrodes (33). The arrangement of the electrode marks (35) represents the arrangement of the electrodes (33) on the front face (31) when viewed from the side of the back face (34) of the semiconductor chip 3. Therefore, the semiconductor chip (3) can easily be positioned with the front face downward on the basis of the electrode marks (35).
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申请公布号 |
US2002190369(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020211308 |
申请日期 |
2002.08.05 |
申请人 |
HIKITA JUNICHI;YAMAMOTO KOJI;NISHIMURA ISAMU;KUMAMOTO NOBUHISA |
发明人 |
HIKITA JUNICHI;YAMAMOTO KOJI;NISHIMURA ISAMU;KUMAMOTO NOBUHISA |
分类号 |
H01L23/544;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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