| 发明名称 |
Process of thinning and blunting semiconductor wafer edge and resulting wafer |
| 摘要 |
A wafer having a rounded edge is thinned to 100 microns or less, producing a tapered razor like edge. The edge is ground to blunt it and reduce danger to personnel and equipment during handling of the wafer.
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| 申请公布号 |
US2002192964(A1) |
申请公布日期 |
2002.12.19 |
| 申请号 |
US20020225551 |
申请日期 |
2002.08.19 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
FRANCIS RICHARD |
| 分类号 |
B24B9/06;H01L21/304;(IPC1-7):H01L21/302 |
主分类号 |
B24B9/06 |
| 代理机构 |
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代理人 |
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| 地址 |
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