发明名称 |
Semiconductor die including conductive columns |
摘要 |
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the mask is disposed over the conductive region. A pre-formed conductive column is placed in the aperture and is bonded to the conductive region. |
申请公布号 |
US2002192935(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20010881787 |
申请日期 |
2001.06.15 |
申请人 |
JOSHI RAJEEV;WU CHUNG-LIN |
发明人 |
JOSHI RAJEEV;WU CHUNG-LIN |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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