LOW-TEMPERATURE PATTERNED WAFER BONDING WITH PHOTOSENSITIVE BENZOCYCLOBUTENE (BCB) AND 3D MEMS (MICROELECTROMECHANICAL SYSTEMS) STRUCTURE FABRICATION

摘要

A method of low-temperature (150-300 DEG C) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer (100) having a first surface and a second pre-processed wafer (102) having a second surface. Photosensitive benzocyclobutene (BCB) polymer (106) is then applied to the first surface of the first wafer (100) in a predetermined pattern to define a bonding layer. The second wafer (102) is then bonded to the first wafer (100) only along the bonding layer.