发明名称 |
Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same |
摘要 |
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3x10-6/K at 30-800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
|
申请公布号 |
US2002191377(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20010009822 |
申请日期 |
2001.12.13 |
申请人 |
OSADA MITSUO;HIRAYAMA NORIO;ARIKAWA TADASHI;AMANO YOSHINARO;MAESATO HIDETOSHI;HAYASHI HIDEFUMI;MURAI HIROSHI |
发明人 |
OSADA MITSUO;HIRAYAMA NORIO;ARIKAWA TADASHI;AMANO YOSHINARO;MAESATO HIDETOSHI;HAYASHI HIDEFUMI;MURAI HIROSHI |
分类号 |
H01L23/12;C22C1/04;C22C27/04;C22F1/08;H01L21/48;H01L23/047;H01L23/36;H01L23/373;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|