| 摘要 |
A passive device and module for a transceiver, and a manufacturing method thereof are provided. The passive device includes a semiconductor or a dielectric substrate, at least one capacitor, at least one inductor, a viahole, a metal electrode, radio frequency signals, a radio frequency ground, a packaging substrate. The at least one capacitor is formed on a first surface of the substrate. The at least one inductor is formed on a second surface of the substrate that is opposite to the first surface. The viahole penetrates through the substrate. The metal electrode is formed on the viahole and electrically connects the capacitor on the first surface and the inductor on the second surface. Radio frequency signals are for the inductor and the capacitor. The radio frequency ground is formed on the substrate and isolated from the radio frequency signals. The packaging substrate is bonded on the first surface or the second surface of the substrate, having a cavity covering a structure on the bonded surface of the substrate. A reduction in the area required for mounting passive devices and modules thereof contributes to the downsizing of communication systems. Also, use of MEMS technique can reduce insertion loss of inductors, which improves the communication quality of the communication systems. |
