Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus

摘要

The present invention provides a member for removing foreign matters adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, the first elastic member formed on the base plates and having a material property of flexible deformation by the contact of the probe, specifically, a predetermined Young's modulus, the second elastic member formed on the first elastic member and having a tensile strength and a film thickness capable of responding to a contact stress produced by the contact of the probe, and an abrasive layer formed on the second elastic member and made of hard particles and a binding material which are mixed at a predetermined volume ratio to realize a smooth sliding action of the probe and producing a high abrasive efficiency of the foreign adhering matters. The removing member can smoothly slide the probe thereon to effectively remove the foreign matters adhering to the probe tip.