发明名称 |
Temperature measuring method and apparatus, measuring method for the thickness of the formed film, measuring apparatus for the thickness of the formed film thermometer for wafers |
摘要 |
A temperature measuring apparatus, comprises a light splitting section for splitting the light radiated from a substrate into plural light components having wavelengths over a predetermined wavelength region, a detection section for detecting the intensities of the light components obtained by the light splitting section, an integrated value calculating section for calculating an integrated value of radiation intensity by cumulatively adding the intensities of the light components detected by the detecting section, and a surface temperature calculating section for calculating the surface temperature of the substrate from the integrated value, on the basis of reference data representing the relation between the temperature and the integrated value.
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申请公布号 |
US2002192847(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020206186 |
申请日期 |
2002.07.29 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
INO TOMOMI;SOGA AKIRA;AKAMA YOSHIAKI |
分类号 |
G01J5/00;(IPC1-7):H01L21/66;G01R31/26 |
主分类号 |
G01J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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