SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME

摘要

A semiconductor device for producing a movable section by using the sacrifice etching technique, wherein in order to prevent the sticking of the movable section during the sacrifice layer etching process, the movable section is formed with a reinforcing layer before the sacrifice layer etching process to temporarily increase the rigidity of the movable section, the reinforcing layer being removed after completion of the sacrifice layer etching process. The semiconductor device solves the problem of sticking of the movable section without increasing the rigidity of the movable section more than necessary, and is high in yield.