| 摘要 |
<p>An optical device (30) is formed by a first chip (4) and a second chip (5) bonded together. The first chip (4) has an optical layer (21) of glass housing an optical circuit (2); the second chip (5) has a body (41) of semiconductor material housing integrated electronic components (11) and coated with a bonding layer (31) of glass fixed directly and contiguous to the optical layer (21) of the first chip (4). The bonding layer (31) delimits cavities (32) facing corresponding cavities (8) in the first chip in positions corresponding to the intersection points (3) of waveguides (2) constituting the optical circuit. The cavities (8, 32) are filled with a liquid having the same refractive index as the waveguides. Underneath each cavity (32), in the body (41) of semiconductor material there is present a resistor (11), which, when traversed by current, causes formation of a bubble inside the chamber (3) and deflection of the light beam traversing a waveguide towards a different waveguide. <IMAGE></p> |
