| 摘要 |
PURPOSE: An apparatus and a method for exposing a circumference of a semiconductor wafer are provided to remove a photoresist bead from an edge portion of photoresist coated on an upper surface of a semiconductor wafer in a photolithography process. CONSTITUTION: A quadrilateral beam(120) emitted from an optical fiber module(110) has a rectangular section. A couple of optical module holders(109,111) can be installed at an input terminal and an output terminal of the optical fiber module(110). The quadrilateral beam(120) emitted from the optical fiber module(110) penetrates a couple of cylindrical lenses(130). The quadrilateral beam(120) is converted to the non-spread beam(150) of rectangular shape by penetrating the cylindrical lens couple(130). The cylindrical lens couple(130) is formed with rectangular concave lenses. A band pass filter(190) is used for passing only a predetermined band of photoresist.
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