| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material for semiconductor sealing use having excellent soldering crack resistance and resistance to thermal cycling test. SOLUTION: The epoxy resin molding material for semiconductor sealing use contains (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler and (D) a cure accelerator and gives a temperature dispersion curve of the dynamic viscoelasticity of the cured material having a dispersion peak of Tanδat -130 to -70 deg.C or -30 to +30 deg.C.
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