发明名称 THERMOSETTING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting composition (especially a composition containing an oxetane compound such as a non-acrylic compound containing oxetane ring) capable of forming a cured film (coating film) having improved tackiness while keeping high adhesivity to various substrates. SOLUTION: The purpose is fulfilled by a thermosetting composition containing (A) a non-acrylic compound containing oxetane ring, (B) a (meth) acrylic acid ester containing siloxane bond or its polymer, (C) a non-acrylic compound containing oxirane ring, (D) a polyol compound and (E) a thermal cationic polymerization initiator.
申请公布号 JP2002363260(A) 申请公布日期 2002.12.18
申请号 JP20010171967 申请日期 2001.06.07
申请人 UBE IND LTD 发明人 MIWA YOSHIYUKI
分类号 C08G59/62;C09D4/02;C09D5/00;C09D133/06;C09D163/00;C09D167/00;C09D167/04;C09D171/00;(IPC1-7):C08G59/62 主分类号 C08G59/62
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