METHOD AND APPARATUS FOR CHARGING HOLE OF PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method and an apparatus for charging a hole of a printed circuit board and a method for fabricating a printed circuit board are provided to prevent generation of air bubbles by filling effectively a photoresist material into a via-hole and a through-hole. CONSTITUTION: A plurality of surface circuits(1a,1a) are formed on each surface of both sides of a substrate(1). A plurality of internal circuits(1b,1b) are formed in the inside of the substrate(1). A plurality of via-holes(1c) is formed to connect the surface circuit(1a) with the internal circuit(1b). A plurality of through-holes(1d) is formed to connect the surface circuit(1a) with the internal circuit(1b). A metal layer is formed on outer surfaces of the via-holes(1c) and the through-holes(1d). A photoresist material is coated on a surface of the metal layer in order to protect the metal layer. A mask(10) is stacked on an upper surface of the substrate(1). The photoresist material is filled in the via-hole(1c) by pushing a squeeze(20) to a front direction. The photoresist material is filled in the through-hole(1d) by using a screen printing method or a roller coating method.