SEAL FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a seal for a semiconductor device excellent in sealing properties. SOLUTION: The seal for a semiconductor device is obtained by polyol vulcanization of a composition comprising 100 pts.wt. of a vinylidene fluoride/ hexafluoropropylene copolymer having a Mooney viscosity ML1+10 (100 deg.C) of at least 60 and, incorporated therewith, 10-100 pts.wt. of a filler.