Transfer material, method for producing the same and wiring substrate produced by using the same

摘要

A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the 'first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.