| 摘要 |
PURPOSE: A method for correcting an alignment of semiconductor wafers is provided to improve a productivity and to reduce a damage of products by correcting misalignment every shot unit. CONSTITUTION: Two shots(12,14) are formed in a wafer(10). The first and second shots(12,14) further include three chips(16,18,20,22,24,26), respectively. In order to supply correction data every shot unit, a wafer align correction apparatus comprises a plurality of steppers and a microprocessor. In the microprocessor, overlay correction data for offset of a reticle region, reduction and rotation stores every shot unit. At this time, when a misalignment is generated in a specific shot, the overlay correction data is applied to the corresponding stepper.
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