| 摘要 |
PROBLEM TO BE SOLVED: To provide a head chip and its manufacturing method in which manufacturing processes are reduced by easily and surely connecting electrodes inside chambers and dummy chambers and wiring lines each other, and manufacturing costs are reduced. SOLUTION: Dummy chambers 18 and chambers 17 shorter than dummy chambers 18 are opened to a surface of a substrate 16. Moreover, a wiring pattern 81 for discrete electrodes for mutually electrically connecting discrete electrodes 20b corresponding to respective chambers 17 is set to rear end parts at the opposite side to nozzle openings of the dummy chambers 18 at both sides of each chamber 17. At the same time, a wiring pattern 80 for common electrodes which communicates with each of common electrodes 20a in the chambers 17 is set to rear end parts of the chambers 17. |
