APPARATUS FOR LIQUID TREATMENT OF FLAT MATERIALS

摘要

Plating or etching or other immersion treatment of lower portions only of horizontally fed, vertical positioned thin strips and arrays of workpieces is accomplished by recirculating electrolyte or the like through a bathtub provided with vertical slots to receive and discharge such workpieces. The rate of recirculation is such that an effective plating height well above the bottom of the vertical bathtub slots is maintained. A plurality of horizontally moving clamps support the workpieces and are electrically connected thereto as the workpieces move into, through, and out of the bathtub. These clamps are also electrically slidably connected to bus bars to form part of a complete electroplating circuit.