| 摘要 |
PROBLEM TO BE SOLVED: To provide an ion-plating apparatus which is suitable for depositing a metal film or an alloy film of the surface of a substrate, and, in particular, capable of continuously depositing the film on a large substrate with high accuracy. SOLUTION: A plurality of evaporation sources comprising an induction heating unit and an insertion unit for continuously feeding a metal for film deposition in the induction heating unit are installed in the longitudinal direction of vacuum chamber side wall, and a pair of plasma generation electrodes are provided in the vicinity of the evaporation sources.
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