| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating solution which requires no discharge thereof by using a non-polluting reduction material requiring no waste water discharge treatment or the like as a reduction material for chemically precipitating metal on the surface of the object to be plated, and also preventing the accumulation of oxide produced by the reduction material after the reduction of metal, and an electroless plating method. SOLUTION: In electroless plating by the well known plating method, a metallic salt aqueous solution which does not contain the conventional reduction agent such as formalin, hydrazine and hypophophite is prepared. As a reduction agent, hydrogen radicals are fed to the above metallic salt aqueous solution. Metallic ions in the metallic salt aqueous solution are reduced into metal and precipitated on the surface of the object to be plated.
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