| 摘要 |
PURPOSE: A handler apparatus for inspecting a semiconductor package is provided to perform effectively a classification process according to an inspected result by improving a structure of the handler. CONSTITUTION: The first robot(11) includes the first and the second absorbing nozzle heads. The first absorbing nozzle head of the first robot(11) is used for absorbing a semiconductor package from a tray supplied to the first supply station(12) to move the semiconductor package to a heater block(13). The second absorbing nozzle head of the first robot(11) is used for transferring the semiconductor package from the heater block(13) to a loading shuttle(14). The loading shuttle(14) is used for transferring the semiconductor package to a standby stage(15). The semiconductor package is transferred to a test stage(16) by a rotary absorbing nozzle apparatus. The inspected semiconductor package is transferred to the second robot(18) by an unloading shuttle(17). The semiconductor packages are classified into the first to the fourth classification stations(1,2,3,4) by the second robot(18). An empty tray is moved to a buffering station(19). The third robot(10) is used for moving the empty tray among the first supply station(12), the buffering station(19), and each classification station(1,2,3,4).
|
