发明名称 APPARATUS FOR PICKING UP COMPONENTS
摘要 PURPOSE: An apparatus for picking up components is provided to correct a loading error of a semiconductor chip or a semiconductor component by supporting the semiconductor chip or the semiconductor component. CONSTITUTION: A pickup device(20) is supported by a robot or a manipulator(200). A main body(21) of the pickup device(20) has a predetermined cavity(22). A rolling plate(24) having an extended part(23) is slid into the cavity(22) of the main body(21). A support portion(30) is installed at the main body(21). The support portion(30) includes a rotary shaft portion(31) and a plurality of upper and lower lubricating support portions. A grasping portion is installed at an end portion of the extended portion(23). A fixing portion is installed at the main body(21) in order to fix a position of the rolling plate(24). The rotary shaft portion(31) has the first inlet groove(31a) and a hinge member(31b).
申请公布号 KR20020094615(A) 申请公布日期 2002.12.18
申请号 KR20010032943 申请日期 2001.06.12
申请人 LEE, KEUN WOO 发明人 LEE, HUI JUN;LEE, KEUN WOO
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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