发明名称 |
APPARATUS FOR PICKING UP COMPONENTS |
摘要 |
PURPOSE: An apparatus for picking up components is provided to correct a loading error of a semiconductor chip or a semiconductor component by supporting the semiconductor chip or the semiconductor component. CONSTITUTION: A pickup device(20) is supported by a robot or a manipulator(200). A main body(21) of the pickup device(20) has a predetermined cavity(22). A rolling plate(24) having an extended part(23) is slid into the cavity(22) of the main body(21). A support portion(30) is installed at the main body(21). The support portion(30) includes a rotary shaft portion(31) and a plurality of upper and lower lubricating support portions. A grasping portion is installed at an end portion of the extended portion(23). A fixing portion is installed at the main body(21) in order to fix a position of the rolling plate(24). The rotary shaft portion(31) has the first inlet groove(31a) and a hinge member(31b).
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申请公布号 |
KR20020094615(A) |
申请公布日期 |
2002.12.18 |
申请号 |
KR20010032943 |
申请日期 |
2001.06.12 |
申请人 |
LEE, KEUN WOO |
发明人 |
LEE, HUI JUN;LEE, KEUN WOO |
分类号 |
H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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