| 摘要 |
Preparation of semiconductor switches using micromodular methods of construction, in which a number of semiconducting plates or wafers, each of which contains at least a single building unit, is soldered to a thin insulated plate e.g. of copper plated ceramic, glass or the like having a metallised switch pattern on at least one side, and fixed to a support by a plurality of wire connections which is characterised by the following (partly known) features (a) all the electrodes, e.g. (1), (2), (3), (7), (10) are arranged on a surface of the semiconducting plate (1a) or (1b), and each carries a coating of a solder material on a large surface of contact (4), (5), (6), (9), (11). (b) the semiconducting plates and the electrodes are inserted in the opening of a template and then placed on the insulating plate in such a way that the large contact surfaces, e.g. (4), (5), etc. are in contact with the switch pattern, and are then soldered by heating, and after cooling the template is removed. (c) the insulated plate is connected to the support wires by soldering these in metallised holes therein. |
