| 摘要 |
PROBLEM TO BE SOLVED: To provide solder paste of a solder alloy which contains zinc and tin, and has good wettability with a member subjected to gold plating or palladium plating. SOLUTION: The solder paste contains solder alloy powder containing zinc and tin, and flux. The flux contains a sulfur-containing organic compound containing bivalent sulfur. The flux contains an oxidation preventive and a rust preventive. As at least either the oxidation preventive or rust preventive, a sulfur-containing organic compound can be blended into the flux.
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